Passive & Interconnecting Electronic Components Market – Global Industry Size, Share, Trends, Opportunity, and Forecast, Segmented By Type (Passive, Interconnecting), By Application (Consumer Electronics, Automotive, Healthcare, IT & Telecom, Industrial, Aerospace & defense), By Region & Competition, 2019-2029F

  • Industry : ICT
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Summary

Report Description

Forecast Period

2025-2029

Market Size (2023)

USD 185 Billion

Market Size (2029)

USD 253 Billion

CAGR (2024-2029)

5.2%

Fastest Growing Segment

Healthcare

Largest Market

Asia Pacific

Market Overview

Global Passive & Interconnecting Electronic Components Market was valued at USD 185 Billion in 2023 and is anticipated to project robust growth in the forecast period with a CAGR of 5.2% through 2029. The global passive and interconnecting electronic components market is experiencing robust growth driven by the expanding demand for advanced electronic devices and technological innovation. Passive components, such as resistors, capacitors, and inductors, alongside interconnecting components like connectors, sockets, and switches, are integral to the functionality and reliability of electronic systems. The proliferation of smart devices, including smartphones, wearables, and IoT applications, has significantly boosted the need for these components. Additionally, the automotive sector's shift towards electric and autonomous vehicles, coupled with advancements in industrial automation and consumer electronics, further fuels market expansion. The rise of 5G technology and the increasing complexity of electronic systems necessitate high-performance passive and interconnecting components. Manufacturers are investing in research and development to create components that offer enhanced performance, miniaturization, and energy efficiency. Geographic expansion, particularly in emerging markets in Asia-Pacific and Latin America, also contributes to the market's growth. As electronic devices become more sophisticated and ubiquitous, the demand for reliable, high-quality passive and interconnecting components continues to surge, shaping the market's positive trajectory.

Key Market Drivers

Growth in Consumer Electronics

The rapid expansion of the consumer electronics sector is a major driver of the global passive and interconnecting electronic components market. The increasing adoption of smartphones, tablets, wearable devices, and smart home technologies has significantly boosted the demand for electronic components. These devices require a variety of passive components, such as resistors, capacitors, and inductors, as well as interconnecting components like connectors and switches, to ensure optimal performance and reliability. As consumer electronics become more advanced and feature-rich, the need for high-quality and miniaturized components grows. Innovations in consumer electronics, including advancements in IoT and 5G technologies, further drive this demand. The proliferation of connected devices and the ongoing trend toward miniaturization necessitate the integration of sophisticated passive and interconnecting components that can support higher data transfer rates, reduced power consumption, and enhanced functionality. Consequently, the consumer electronics boom is a key factor propelling the growth of the passive and interconnecting electronic components market.

Rise of Automotive Electronics

The rise of automotive electronics is significantly influencing the global market for passive and interconnecting electronic components. Modern vehicles are increasingly equipped with advanced electronic systems, including infotainment systems, driver assistance technologies, electric powertrains, and autonomous driving capabilities. These systems require a wide range of passive components, such as capacitors and resistors, as well as interconnecting components like connectors and terminals, to ensure reliable operation and performance. The shift towards electric vehicles (EVs) and hybrid vehicles further amplifies this demand, as these vehicles incorporate complex electronic systems that necessitate robust and efficient components. Additionally, advancements in automotive technology, such as vehicle-to-everything (V2X) communication and advanced driver assistance systems (ADAS), require sophisticated electronic components to support enhanced functionality and safety features. The automotive industry's transformation towards more electronic integration drives the demand for high-quality passive and interconnecting components, fueling market growth.

Expansion of Industrial Automation

The expansion of industrial automation is a significant driver of the passive and interconnecting electronic components market. The rise of Industry 4.0 and the increasing adoption of automation technologies in manufacturing processes necessitate a wide array of electronic components. Passive components, including capacitors, resistors, and inductors, are critical for the stability and performance of industrial machinery and control systems. Similarly, interconnecting components such as connectors and terminals are essential for establishing reliable communication between various automation systems and devices. The implementation of smart sensors, programmable logic controllers (PLCs), and robotics in industrial settings relies heavily on these components to ensure precise control and data acquisition. As industries continue to embrace automation and smart technologies to improve efficiency, reduce costs, and enhance productivity, the demand for high-quality passive and interconnecting components will continue to rise. This trend underscores the growing importance of these components in supporting the advancement of industrial automation and smart manufacturing.

Increasing Deployment of 5G Technology

The deployment of 5G technology is driving substantial growth in the global market for passive and interconnecting electronic components. The transition to 5G networks requires significant upgrades to existing infrastructure and the integration of new technologies, all of which rely on advanced electronic components. Passive components such as filters, capacitors, and inductors are essential for managing signal integrity and ensuring the efficient operation of 5G equipment. Interconnecting components, including connectors and antennas, play a critical role in facilitating high-speed data transmission and maintaining reliable network connectivity. The demand for 5G technology is accelerating the development and deployment of advanced communication systems, including base stations, small cells, and edge computing devices. As telecommunications providers and network operators invest heavily in 5G infrastructure to support higher data speeds and greater network capacity, the need for specialized passive and interconnecting components will continue to grow. This trend highlights the pivotal role of electronic components in enabling the next generation of wireless communication technologies.


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Key Market Challenges

Supply Chain Disruptions

Supply chain disruptions present a significant challenge for the global passive and interconnecting electronic components market. The industry relies on a complex network of suppliers for raw materials, such as metals and semiconductors, and for the manufacturing of components. Disruptions in the supply chain—caused by factors such as geopolitical tensions, natural disasters, or global pandemics—can lead to delays, increased costs, and shortages of critical materials. For instance, the COVID-19 pandemic highlighted the vulnerabilities in global supply chains, causing widespread delays and shortages in electronic components. These disruptions can lead to extended lead times and higher production costs, impacting the ability of manufacturers to meet demand and maintain competitive pricing. Furthermore, fluctuations in material prices due to supply chain issues can affect the overall cost structure for manufacturers, potentially leading to increased prices for end-users. To mitigate these challenges, companies must implement robust risk management strategies, diversify their supply sources, and enhance supply chain visibility to minimize the impact of disruptions and ensure continuity in production.

Technological Obsolescence

Technological obsolescence is a critical challenge facing the passive and interconnecting electronic components market. The rapid pace of technological advancement in electronics means that components can quickly become outdated as new technologies emerge. For example, as electronic devices become more compact and feature-rich, there is an increasing demand for smaller and more advanced components. Passive components, such as resistors and capacitors, and interconnecting components, like connectors and switches, must evolve to meet these new requirements. Companies face the challenge of continuously updating their product offerings and investing in research and development to stay ahead of technological trends. Failure to do so can result in reduced competitiveness and diminished market share. Moreover, the integration of new technologies with existing systems can pose compatibility challenges, potentially slowing down the adoption of advanced solutions. Addressing technological obsolescence requires ongoing innovation and a proactive approach to product development to ensure that components meet the evolving needs of the electronics industry.

Regulatory Compliance and Environmental Standards

Navigating regulatory compliance and environmental standards is a significant challenge for the passive and interconnecting electronic components market. With increasing global emphasis on environmental sustainability, manufacturers are required to adhere to stringent regulations regarding the use of hazardous materials and waste management. For example, regulations such as the European Union's Restriction of Hazardous Substances (RoHS) directive mandate the reduction or elimination of hazardous substances, including lead, in electronic components. Compliance with these regulations necessitates investment in new materials and processes, which can increase production costs. Additionally, the need to meet diverse regulatory requirements across different regions adds complexity to the manufacturing process. Companies must continuously adapt to changing regulations and implement effective waste management and recycling programs to minimize their environmental impact. Failure to comply with regulatory standards can result in legal penalties, damage to brand reputation, and loss of market access. Therefore, navigating these regulatory and environmental challenges is crucial for maintaining compliance and sustaining market growth.

Market Saturation and Competitive Pressure

Market saturation and competitive pressure are significant challenges impacting the global passive and interconnecting electronic components market. As the electronics industry grows, the market for passive and interconnecting components becomes increasingly crowded with numerous players offering similar products. This saturation leads to heightened competition, driving down prices and compressing profit margins. Manufacturers must continuously innovate and differentiate their products to maintain a competitive edge. Additionally, the pressure to reduce costs while meeting high-quality standards requires efficient manufacturing processes and effective supply chain management. Companies are also faced with the challenge of addressing diverse customer needs and preferences across various industries, from consumer electronics to automotive and medical devices. To navigate market saturation and competitive pressure, companies must focus on enhancing product performance, investing in research and development, and leveraging technological advancements. Developing strong customer relationships and providing value-added services can also help companies differentiate themselves and secure a competitive position in the market.

Key Market Trends

Integration of Miniaturized Components

The trend towards miniaturization is profoundly influencing the global passive and interconnecting electronic components market. As electronic devices become smaller and more compact, there is an increasing demand for miniature passive components, such as resistors, capacitors, and inductors, as well as compact interconnecting components like connectors and switches. Miniaturized components are essential for the design and functionality of advanced consumer electronics, including smartphones, wearables, and IoT devices. The shift towards miniaturization is driven by the need for higher performance in smaller form factors, enabling devices to offer enhanced features without compromising on size or weight. Manufacturers are responding by developing smaller, more efficient components that can deliver high performance while fitting into increasingly confined spaces. This trend is also fostering innovation in packaging technologies and materials, aimed at supporting the miniaturization of electronic assemblies. As technology continues to advance and consumer demand for compact, high-performance devices grows, the market for miniaturized passive and interconnecting components is expected to expand, driving further growth and innovation in the industry.

Expansion of 5G and High-Speed Communication Technologies

The deployment of 5G and high-speed communication technologies is a major trend shaping the global passive and interconnecting electronic components market. The rollout of 5G networks requires a range of advanced components to support higher data speeds, increased bandwidth, and improved signal integrity. Passive components such as filters, capacitors, and inductors play a critical role in managing signal quality and reducing interference in high-speed communication systems. Similarly, interconnecting components, including high-frequency connectors and antennas, are essential for maintaining reliable and efficient data transmission. The transition to 5G technology is driving demand for specialized components that can handle the increased data rates and frequencies associated with 5G networks. Additionally, the growth of high-speed communication technologies in other sectors, such as data centers and telecommunications, further contributes to the demand for advanced passive and interconnecting components. As the deployment of 5G and high-speed communication technologies continues to accelerate, the market for these components is expected to grow, driven by the need for enhanced performance and reliability in modern communication systems.

Surge in Automotive Electronics

The surge in automotive electronics is a significant trend influencing the global passive and interconnecting electronic components market. Modern vehicles are increasingly equipped with sophisticated electronic systems, including advanced driver assistance systems (ADAS), infotainment systems, and electric powertrains. These systems rely on a wide array of passive components, such as capacitors, resistors, and inductors, as well as interconnecting components like connectors and terminals, to ensure reliable operation and performance. The growing adoption of electric vehicles (EVs) and hybrid vehicles, coupled with advancements in autonomous driving technology, further drives the demand for advanced electronic components. Automotive manufacturers require components that can withstand harsh operating conditions and meet stringent safety and reliability standards. The integration of new technologies, such as vehicle-to-everything (V2X) communication and advanced sensor systems, also contributes to the growing need for high-quality passive and interconnecting components. As the automotive industry continues to evolve and incorporate more electronic systems, the market for these components is expected to expand, driven by the need for innovation and reliability in modern vehicles.

Focus on Sustainable and Green Technologies

The focus on sustainable and green technologies is a prominent trend impacting the global passive and interconnecting electronic components market. There is an increasing emphasis on reducing the environmental impact of electronic components by adopting eco-friendly materials and processes. Regulatory requirements, such as the European Union's Restriction of Hazardous Substances (RoHS) directive, mandate the reduction or elimination of hazardous materials, including lead, in electronic components. This regulatory pressure, combined with growing consumer demand for environmentally responsible products, drives the shift towards sustainable materials and manufacturing practices. Manufacturers are investing in research and development to develop lead-free solders, recyclable materials, and energy-efficient production processes. Additionally, there is a growing focus on improving the longevity and recyclability of electronic components to minimize waste and environmental impact. As sustainability becomes a more critical consideration for both consumers and regulators, the market for eco-friendly passive and interconnecting components is expected to grow, reflecting the industry's commitment to environmental stewardship and innovation.

Advancements in Smart and Connected Devices

The advancement of smart and connected devices is a significant trend shaping the global passive and interconnecting electronic components market. The rise of the Internet of Things (IoT) and smart technologies has led to an increased demand for electronic components that support connectivity, sensing, and automation. Passive components, such as capacitors and inductors, are essential for ensuring the stable operation of smart devices, while interconnecting components, including connectors and interfaces, are critical for facilitating communication between devices. The proliferation of smart home appliances, wearable technology, and industrial IoT applications requires high-performance components that can handle the demands of constant connectivity and data exchange. Manufacturers are developing innovative solutions to address the unique challenges of smart and connected devices, including miniaturized components, advanced signal processing, and low-power solutions. As the market for smart and connected devices continues to expand, driven by advancements in technology and increasing consumer adoption, the demand for specialized passive and interconnecting components is expected to grow, supporting the development of the next generation of intelligent electronic systems.

Segmental Insights

Application Insights

The consumer electronics segment emerged as the dominant force in the global passive and interconnecting electronic components market and is projected to maintain its leading position throughout the forecast period. The consumer electronics sector encompasses a wide range of devices, including smartphones, tablets, laptops, wearables, and home appliances, all of which require extensive use of passive and interconnecting components for their operation. The rapid evolution and proliferation of smart devices, driven by technological advancements and increasing consumer demand, significantly contribute to the robust growth of this segment. Passive components such as capacitors, resistors, and inductors are essential for ensuring the functionality, reliability, and performance of these devices. Interconnecting components, including connectors and sockets, play a crucial role in enabling seamless communication and integration within consumer electronics. The ongoing trend towards miniaturization and enhanced performance in consumer electronics further reinforces the demand for high-quality passive and interconnecting components. While other sectors such as automotive, healthcare, IT & telecom, industrial, and aerospace & defense also contribute significantly to the market, the sheer volume and continuous innovation within the consumer electronics industry drive its dominance. As technological advancements continue to accelerate and consumer preferences evolve, the consumer electronics segment is expected to sustain its leading position, shaping the direction of the passive and interconnecting electronic components market in the foreseeable future.


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Regional Insights

The Asia-Pacific region dominated the global passive and interconnecting electronic components market and is expected to sustain its leadership throughout the forecast period. This dominance can be attributed to the region's robust electronics manufacturing ecosystem, which includes major economies such as China, Japan, South Korea, and Taiwan. The Asia-Pacific region is a global hub for electronics production, hosting numerous leading manufacturers and suppliers of passive and interconnecting components. The region benefits from a well-established supply chain, cost advantages, and significant investments in technology and infrastructure, which collectively enhance its market position. The rapid expansion of consumer electronics, automotive electronics, and industrial automation in Asia-Pacific further drives the demand for high-performance passive and interconnecting components. Additionally, the region's growing focus on smart technologies, including 5G, IoT, and AI, amplifies the need for advanced electronic components to support these innovations. Emerging markets within Asia-Pacific also contribute to the region's market dominance, as increasing industrialization and consumer electronics adoption boost demand for electronic components. The combination of high manufacturing capacity, technological advancement, and a growing end-user base positions Asia-Pacific as the central player in the global passive and interconnecting electronic components market. As the demand for sophisticated electronics continues to rise and technological developments advance, the Asia-Pacific region is set to maintain its dominant role, driving the market's growth and shaping industry trends in the coming years.

Recent Developments

  • In March 2024, KEMET, a division of the YAGEO Group, announced the launch of the T581 capacitors, which comply with the Military Performance Specification Sheets MIL-PRF-32700/2. These capacitors, with a 35V rating, are designed to meet the rigorous demands of military applications by offering MIL-PRF-certified reliability and leveraging the high volumetric efficiency of polymer tantalum technology. This technology is particularly advantageous for high-efficiency, fast-switching DC/DC converters.
  • In February 2024, Samtec introduced the latest additions to its Edge Rate connector line with the ERM6 and ERF6 Series. These new connectors feature a denser mated set, reduced width, and a slim profile of just 5 mm. They are tailored for industries including embedded vision, industrial, instrumentation, and robotics, and support high-speed applications with data rates up to 56 Gbps PAM4.
  • In October 2023, TDK Corporation introduced the PLEA85 series of high-efficiency power inductors, designed to enhance the operating times of battery-powered wearables and similar devices. The PLEA85 series features a compact profile achieved through TDK’s innovative low-loss magnetic materials and advanced thin-film processing techniques. Measuring just 1.0 mm (length) x 0.8 mm (width) x 0.55 mm (height), these inductors enable engineers to integrate low-profile Integrated Circuits (ICs), such as Chip Scale Packages (CSPs), facilitating more compact design solutions. The inductors' bottom electrode and partially L-shaped side design support high-density surface mounting, reduce the risk of misplacement during installation, and enhance terminal strength, leading to a more durable end product.
  • In March 2023, Murata Manufacturing Co., Ltd. inaugurated a new 200-mm mass production line in Caen, France, dedicated to the manufacture of Silicon Capacitors. This line utilizes 200 mm wafers and leverages advanced PICS technology to deliver superior electrical performance. Targeted primarily at the mobile handset market, these capacitors offer high capacitance values and exceptional performance within extremely small sizes and thicknesses as thin as 40 µm.

Key Market Players

  • Murata Manufacturing Co., Ltd.
  • TDK Corporation
  • Yageo Corporation
  • Vishay Intertechnology, Inc.
  • KYOCERA AVX Components Corporation
  • TE Connectivity Ltd.
  • Panasonic Corporation
  • Samsung Electronics Co., Ltd.
  • Littelfuse, Inc.
  • Rohm Co. Ltd
  • Würth Elektronik eiSos GmbH & Co. KG
  • Broadcom Inc.

By Type

  By Application

By Region
  • Passive
  • Interconnecting
  • Consumer Electronics
  • Automotive
  • Healthcare
  • IT & Telecom
  • Industrial
  • Aerospace & defense
  • North America
  • Europe
  • Asia Pacific
  • South America
  • Middle East & Africa

Report Scope:

In this report, the Global Passive & Interconnecting Electronic Components Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

  • Passive & Interconnecting Electronic Components Market, By Type:

o   Passive

o   Interconnecting

  • Passive & Interconnecting Electronic Components Market, By Application:

o   Consumer Electronics

o   Automotive

o   Healthcare

o   IT & Telecom

o   Industrial

o   Aerospace & defense

  • Passive & Interconnecting Electronic Components Market, By Region:

o   North America

§  United States

§  Canada

§  Mexico

o   Europe

§  France

§  United Kingdom

§  Italy

§  Germany

§  Spain

§  Belgium

o   Asia-Pacific

§  China

§  India

§  Japan

§  Australia

§  South Korea

§  Indonesia

§  Vietnam

o   South America

§  Brazil

§  Argentina

§  Colombia

§  Chile

§  Peru

o   Middle East & Africa

§  South Africa

§  Saudi Arabia

§  UAE

§  Turkey

§  Israel

Competitive Landscape

Company Profiles: Detailed analysis of the major companies present in the Global Passive & Interconnecting Electronic Components Market.

Available Customizations:

Global Passive & Interconnecting Electronic Components market report with the given market data, Tech Sci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

Company Information

  • Detailed analysis and profiling of additional market players (up to five).

Global Passive & Interconnecting Electronic Components Market is an upcoming report to be released soon. If you wish an early delivery of this report or want to confirm the date of release, please contact us at [email protected]

Table of content

1.    Product Overview

1.1.  Market Definition

1.2.  Scope of the Market

1.2.1.    Markets Covered

1.2.2.    Years Considered for Study

1.2.3.    Key Market Segmentations

2.    Research Methodology

2.1.  Objective of the Study

2.2.  Baseline Methodology

2.3.  Formulation of the Scope

2.4.  Assumptions and Limitations

2.5.  Sources of Research

2.5.1.    Secondary Research

2.5.2.    Primary Research

2.6.  Approach for the Market Study

2.6.1.    The Bottom-Up Approach

2.6.2.    The Top-Down Approach

2.7.  Methodology Followed for Calculation of Market Size & Market Shares

2.8.  Forecasting Methodology

2.8.1.    Data Triangulation & Validation

3.    Executive Summary

4.    Impact of COVID-19 on Global Passive & Interconnecting Electronic Components Market

5.    Voice of Customer

6.    Global Passive & Interconnecting Electronic Components Market Overview

7.    Global Passive & Interconnecting Electronic Components Market Outlook

7.1.  Market Size & Forecast

7.1.1.    By Value

7.2.  Market Share & Forecast

7.2.1.    By Type (Passive, Interconnecting)

7.2.2.    By Application (Consumer Electronics, Automotive, Healthcare, IT & Telecom, Industrial, Aerospace & defense)

7.2.3.    By Region (North America, Europe, South America, Middle East & Africa, Asia Pacific)

7.3.  By Company (2023)

7.4.  Market Map

8.    North America Passive & Interconnecting Electronic Components Market Outlook

8.1.  Market Size & Forecast

8.1.1.    By Value

8.2.  Market Share & Forecast

8.2.1.    By Type

8.2.2.    By Application

8.2.3.    By Country

8.3.  North America: Country Analysis

8.3.1.    United States Passive & Interconnecting Electronic Components Market Outlook

8.3.1.1.        Market Size & Forecast

8.3.1.1.1.           By Value

8.3.1.2.        Market Share & Forecast

8.3.1.2.1.           By Type

8.3.1.2.2.           By Application

8.3.2.    Canada Passive & Interconnecting Electronic Components Market Outlook

8.3.2.1.        Market Size & Forecast

8.3.2.1.1.           By Value

8.3.2.2.        Market Share & Forecast

8.3.2.2.1.           By Type

8.3.2.2.2.           By Application

8.3.3.    Mexico Passive & Interconnecting Electronic Components Market Outlook

8.3.3.1.        Market Size & Forecast

8.3.3.1.1.           By Value

8.3.3.2.        Market Share & Forecast

8.3.3.2.1.           By Type

8.3.3.2.2.           By Application

9.    Europe Passive & Interconnecting Electronic Components Market Outlook

9.1.  Market Size & Forecast

9.1.1.    By Value

9.2.  Market Share & Forecast

9.2.1.    By Type

9.2.2.    By Application

9.2.3.    By Country

9.3.  Europe: Country Analysis

9.3.1.    Germany Passive & Interconnecting Electronic Components Market Outlook

9.3.1.1.        Market Size & Forecast

9.3.1.1.1.           By Value

9.3.1.2.        Market Share & Forecast

9.3.1.2.1.           By Type

9.3.1.2.2.           By Application

9.3.2.    France Passive & Interconnecting Electronic Components Market Outlook

9.3.2.1.        Market Size & Forecast

9.3.2.1.1.           By Value

9.3.2.2.        Market Share & Forecast

9.3.2.2.1.           By Type

9.3.2.2.2.           By Application

9.3.3.    United Kingdom Passive & Interconnecting Electronic Components Market Outlook

9.3.3.1.        Market Size & Forecast

9.3.3.1.1.           By Value

9.3.3.2.        Market Share & Forecast

9.3.3.2.1.           By Type

9.3.3.2.2.           By Application

9.3.4.    Italy Passive & Interconnecting Electronic Components Market Outlook

9.3.4.1.        Market Size & Forecast

9.3.4.1.1.           By Value

9.3.4.2.        Market Share & Forecast

9.3.4.2.1.           By Component

9.3.4.2.2.           By Application

9.3.5.    Spain Passive & Interconnecting Electronic Components Market Outlook

9.3.5.1.        Market Size & Forecast

9.3.5.1.1.           By Value

9.3.5.2.        Market Share & Forecast

9.3.5.2.1.           By Type

9.3.5.2.2.           By Application

9.3.6.    Belgium Passive & Interconnecting Electronic Components Market Outlook

9.3.6.1.        Market Size & Forecast

9.3.6.1.1.           By Value

9.3.6.2.        Market Share & Forecast

9.3.6.2.1.           By Type

9.3.6.2.2.           By Application

10. South America Passive & Interconnecting Electronic Components Market Outlook

10.1.            Market Size & Forecast

10.1.1. By Value

10.2.            Market Share & Forecast

10.2.1. By Type

10.2.2. By Application

10.2.3. By Country

10.3.            South America: Country Analysis

10.3.1. Brazil Passive & Interconnecting Electronic Components Market Outlook

10.3.1.1.     Market Size & Forecast

10.3.1.1.1.         By Value

10.3.1.2.     Market Share & Forecast

10.3.1.2.1.         By Type

10.3.1.2.2.         By Application

10.3.2. Colombia Passive & Interconnecting Electronic Components Market Outlook

10.3.2.1.     Market Size & Forecast

10.3.2.1.1.         By Value

10.3.2.2.     Market Share & Forecast

10.3.2.2.1.         By Type

10.3.2.2.2.         By Application

10.3.3. Argentina Passive & Interconnecting Electronic Components Market Outlook

10.3.3.1.     Market Size & Forecast

10.3.3.1.1.         By Value

10.3.3.2.     Market Share & Forecast

10.3.3.2.1.         By Type

10.3.3.2.2.         By Application

10.3.4. Chile Passive & Interconnecting Electronic Components Market Outlook

10.3.4.1.     Market Size & Forecast

10.3.4.1.1.         By Value

10.3.4.2.     Market Share & Forecast

10.3.4.2.1.         By Type

10.3.4.2.2.         By Application

10.3.5. Peru Passive & Interconnecting Electronic Components Market Outlook

10.3.5.1.     Market Size & Forecast

10.3.5.1.1.         By Value

10.3.5.2.     Market Share & Forecast

10.3.5.2.1.         By Type

10.3.5.2.2.         By Application

11. Middle East & Africa Passive & Interconnecting Electronic Components Market Outlook

11.1.            Market Size & Forecast

11.1.1. By Value

11.2.            Market Share & Forecast

11.2.1. By Type

11.2.2. By Application

11.2.3. By Country

11.3.            Middle East & Africa: Country Analysis

11.3.1. Saudi Arabia Passive & Interconnecting Electronic Components Market Outlook

11.3.1.1.     Market Size & Forecast

11.3.1.1.1.         By Value

11.3.1.2.     Market Share & Forecast

11.3.1.2.1.         By Type

11.3.1.2.2.         By Application

11.3.2. UAE Passive & Interconnecting Electronic Components Market Outlook

11.3.2.1.     Market Size & Forecast

11.3.2.1.1.         By Value

11.3.2.2.     Market Share & Forecast

11.3.2.2.1.         By Type

11.3.2.2.2.         By Application

11.3.3. South Africa Passive & Interconnecting Electronic Components Market Outlook

11.3.3.1.     Market Size & Forecast

11.3.3.1.1.         By Value

11.3.3.2.     Market Share & Forecast

11.3.3.2.1.         By Type

11.3.3.2.2.         By Application

11.3.4. Turkey Passive & Interconnecting Electronic Components Market Outlook

11.3.4.1.     Market Size & Forecast

11.3.4.1.1.         By Value

11.3.4.2.     Market Share & Forecast

11.3.4.2.1.         By Type

11.3.4.2.2.         By Application

11.3.5. Israel Passive & Interconnecting Electronic Components Market Outlook

11.3.5.1.     Market Size & Forecast

11.3.5.1.1.         By Value

11.3.5.2.     Market Share & Forecast

11.3.5.2.1.         By Type

11.3.5.2.2.         By Application

12. Asia Pacific Passive & Interconnecting Electronic Components Market Outlook

12.1.            Market Size & Forecast

12.1.1. By Value

12.2.            Market Share & Forecast

12.2.1. By Type

12.2.2. By Application

12.2.3. By Country

12.3.            Asia-Pacific: Country Analysis

12.3.1. China Passive & Interconnecting Electronic Components Market Outlook

12.3.1.1.     Market Size & Forecast

12.3.1.1.1.         By Value

12.3.1.2.     Market Share & Forecast

12.3.1.2.1.         By Type

12.3.1.2.2.         By Application

12.3.2. India Passive & Interconnecting Electronic Components Market Outlook

12.3.2.1.     Market Size & Forecast

12.3.2.1.1.         By Value

12.3.2.2.     Market Share & Forecast

12.3.2.2.1.         By Type

12.3.2.2.2.         By Application

12.3.3. Japan Passive & Interconnecting Electronic Components Market Outlook

12.3.3.1.     Market Size & Forecast

12.3.3.1.1.         By Value

12.3.3.2.     Market Share & Forecast

12.3.3.2.1.         By Type

12.3.3.2.2.         By Application

12.3.4. South Korea Passive & Interconnecting Electronic Components Market Outlook

12.3.4.1.     Market Size & Forecast

12.3.4.1.1.         By Value

12.3.4.2.     Market Share & Forecast

12.3.4.2.1.         By Type

12.3.4.2.2.         By Application

12.3.5. Australia Passive & Interconnecting Electronic Components Market Outlook

12.3.5.1.     Market Size & Forecast

12.3.5.1.1.         By Value

12.3.5.2.     Market Share & Forecast

12.3.5.2.1.         By Type

12.3.5.2.2.         By Application

12.3.6. Indonesia Passive & Interconnecting Electronic Components Market Outlook

12.3.6.1.     Market Size & Forecast

12.3.6.1.1.         By Value

12.3.6.2.     Market Share & Forecast

12.3.6.2.1.         By Type

12.3.6.2.2.         By Application

12.3.7. Vietnam Passive & Interconnecting Electronic Components Market Outlook

12.3.7.1.     Market Size & Forecast

12.3.7.1.1.         By Value

12.3.7.2.     Market Share & Forecast

12.3.7.2.1.         By Type

12.3.7.2.2.         By Application

13. Market Dynamics

13.1.            Drivers

13.2.            Challenges

14. Market Trends and Developments

15. Company Profiles

15.1.            Murata Manufacturing Co., Ltd.

15.1.1. Business Overview

15.1.2. Key Revenue and Financials  

15.1.3. Recent Developments

15.1.4. Key Personnel/Key Contact Person

15.1.5. Key Product/Services Offered

15.2.            TDK Corporation

15.2.1. Business Overview

15.2.2. Key Revenue and Financials  

15.2.3. Recent Developments

15.2.4. Key Personnel/Key Contact Person

15.2.5. Key Product/Services Offered

15.3.            Yageo Corporation

15.3.1. Business Overview

15.3.2. Key Revenue and Financials  

15.3.3. Recent Developments

15.3.4. Key Personnel/Key Contact Person

15.3.5. Key Product/Services Offered

15.4.            Vishay Intertechnology, Inc.

15.4.1. Business Overview

15.4.2. Key Revenue and Financials  

15.4.3. Recent Developments

15.4.4. Key Personnel/Key Contact Person

15.4.5. Key Product/Services Offered

15.5.            KYOCERA AVX Components Corporation

15.5.1. Business Overview

15.5.2. Key Revenue and Financials  

15.5.3. Recent Developments

15.5.4. Key Personnel/Key Contact Person

15.5.5. Key Product/Services Offered

15.6.            TE Connectivity Ltd.

15.6.1. Business Overview

15.6.2. Key Revenue and Financials  

15.6.3. Recent Developments

15.6.4. Key Personnel/Key Contact Person

15.6.5. Key Product/Services Offered

15.7.            Panasonic Corporation

15.7.1. Business Overview

15.7.2. Key Revenue and Financials  

15.7.3. Recent Developments

15.7.4. Key Personnel/Key Contact Person

15.7.5. Key Product/Services Offered

15.8.            Samsung Electronics Co., Ltd.

15.8.1. Business Overview

15.8.2. Key Revenue and Financials  

15.8.3. Recent Developments

15.8.4. Key Personnel/Key Contact Person

15.8.5. Key Product/Services Offered

15.9.            Littelfuse, Inc.

15.9.1. Business Overview

15.9.2. Key Revenue and Financials  

15.9.3. Recent Developments

15.9.4. Key Personnel/Key Contact Person

15.9.5. Key Product/Services Offered

15.10.         Rohm Co. Ltd

15.10.1.              Business Overview

15.10.2.              Key Revenue and Financials  

15.10.3.              Recent Developments

15.10.4.              Key Personnel/Key Contact Person

15.10.5.              Key Product/Services Offered

15.11.         Würth Elektronik eiSos GmbH & Co. KG

15.11.1.              Business Overview

15.11.2.              Key Revenue and Financials  

15.11.3.              Recent Developments

15.11.4.              Key Personnel/Key Contact Person

15.11.5.              Key Product/Services Offered

15.12.         Broadcom Inc.

15.12.1.              Business Overview

15.12.2.              Key Revenue and Financials  

15.12.3.              Recent Developments

15.12.4.              Key Personnel/Key Contact Person

15.12.5.              Key Product/Services Offered

16. Strategic Recommendations

17. About Us & Disclaimer

Figures and Tables

Frequently asked questions

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The market size of the Global Passive & Interconnecting Electronic Components Market was USD 185 Billion in 2023.

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In 2023, the Consumer Electronics segment led the Global Passive & Interconnecting Electronic Components Market, driven by the high demand for electronic devices like smartphones, laptops, and wearables. This segment's dominance reflects its critical role in powering and connecting everyday consumer gadgets.

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Asia Pacific was the dominated region in the Global Passive & Interconnecting Electronic Components Market, fueled by the region's strong manufacturing base and high demand for consumer electronics. The presence of major electronics manufacturers and growing technological advancements contribute to its leadership.

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The Major drivers for the global passive and interconnecting electronic components market include the surge in consumer electronics demand, technological advancements in 5G and IoT, the expansion of automotive and industrial sectors, and ongoing innovations in electronic devices and systems.

Related Reports

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Sakshi Bajaal

Business Consultant
Press Release

Passive & Interconnecting Electronic Components Market Expands with Healthcare Segment at a robust CAGR of 5.2% through 2029

Aug, 2024

The global passive and interconnecting electronic components market is rising due to the increasing demand for advanced electronics and miniaturized devices across diverse industries in the forecast

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