Molded Interconnect Device Market – Global Industry Size, Share, Trends, Opportunity, and Forecast, Segmented By Process (Laser Direct Structuring, Two-Shot Molding), By Application (Automotive, Consumer Products, Healthcare, Industrial, Military & Aerospace, Telecommunication, Others), By Region and Competition, 2019-2029F

  • Industry : ICT
  • Pages : NA
  • Published Date : NA
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Summary

Report Description

Forecast Period

2025-2029

Market Size (2023)

USD 3.53 Billion

Market Size (2029)

USD 7.31 Billion

CAGR (2024-2029)

12.73%

Fastest Growing Segment

Two-Shot Molding

Largest Market

Asia Pacific

Market Overview

Global Molded Interconnect Device Market was valued at USD 3.53 Billion in 2023 and is anticipated to project robust growth in the forecast period with a CAGR 12.73% through 2029. The Global Molded Interconnect Device (MID) market is experiencing substantial growth and transformation, driven by a convergence of factors that highlight the versatility and innovative potential of MIDs. MIDs represent a revolutionary approach to electronic component integration, enabling the integration of circuits, sensors, antennas, and more directly into the three-dimensional structures of plastic components. This approach not only streamlines electronic manufacturing but also brings a host of advantages, including miniaturization, cost savings, improved electrical performance, and enhanced aesthetics. The dominance of Laser Direct Structuring (LDS) in the MID manufacturing process underscores the significance of precision and cost-efficiency. LDS facilitates intricate and precise circuit patterns while minimizing material costs and assembly complexities. Its application spans various industries, including consumer electronics, automotive, medical devices, and industrial equipment. Furthermore, advancements in laser technology continue to enhance the capabilities of the LDS process, making it a pivotal driver in the MID market.

Sustainability is a growing trend in the MID market, with a focus on recyclable plastics and eco-friendly materials that reduce the environmental footprint of electronic devices. As consumer demands for sleek and stylish products intensify, MID technology plays a crucial role in achieving enhanced product aesthetics. Its applications are evident across numerous sectors, and the automotive industry is a dominant force in the MID market, driven by advanced driver assistance systems (ADAS), infotainment systems, and the need for space-efficient, lightweight components. As the global demand for compact, high-performance, and sustainable electronic solutions continues to grow, MIDs are poised to remain a critical enabler of innovation and efficiency in electronic design and manufacturing.

Key Market Drivers

Miniaturization and Space Efficiency

One of the primary drivers fueling the global MID (Molded Interconnect Devices) market is the growing demand for miniaturization and space efficiency. MIDs facilitate the integration of electronic components directly into the three-dimensional structure of plastic parts, eliminating the need for additional PCBs (printed circuit boards) and reducing the overall size and weight of electronic devices. This trend is particularly advantageous in industries striving to develop smaller, lighter, and more compact products. The consumer electronics sector, in particular, benefits significantly from this driver, as MIDs enable the design of slim and sleek devices such as smartphones, wearables, and IoT sensors. Additionally, miniaturization is a crucial requirement in applications like automotive electronics, where limited space within the vehicle's interior necessitates the use of compact and efficient electronic components.

Improved Electrical Performance

Another major driver for the global MID market is the continuous pursuit of enhanced electrical performance. MIDs offer several advantages in terms of signal integrity, reduced electromagnetic interference (EMI), and higher frequency operation. By embedding electronic circuits and components directly into the plastic structure, MIDs reduce signal propagation distances, leading to improved electrical performance.

This driver is particularly relevant in applications requiring high-frequency communication, such as 5G devices, Wi-Fi routers, and automotive radar systems. In these applications, MIDs offer a competitive edge by minimizing signal loss and EMI, resulting in better overall device performance.

Cost Savings and Simplified Assembly

Cost-effectiveness and simplified assembly are key drivers of the global MID market. MIDs streamline the manufacturing process by consolidating multiple components into a single structure, reducing the number of parts and assembly steps. This simplification translates to significant cost savings, as it reduces material, labor, and assembly costs. Industries such as automotive, where cost efficiency is critical, are increasingly turning to MIDs to optimize production processes. By integrating several functions into a single MID component, automakers can reduce both material costs and assembly time, ultimately leading to cost savings and improved competitiveness.

Enhanced Product Aesthetics

The aesthetic appeal of products is an essential driver in the global MID market, as MIDs offer unique design possibilities that traditional electronic packaging methods cannot match. MIDs enable the integration of electronic circuits and components beneath the surface of a product, allowing for cleaner and more streamlined designs.

Consumers are increasingly demanding stylish and visually appealing products, particularly in industries like consumer electronics, automotive, and smart home devices. MIDs address this demand by facilitating innovative and aesthetically pleasing product designs. For example, MIDs enable hidden or integrated touch controls, backlit surfaces, and seamless, uncluttered exteriors in various electronic devices.


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Key Market Challenges

Design Complexity and Expertise

One of the primary challenges in the global MID market is the complexity of designing effective MIDs. Developing MIDs involves integrating electronic circuits, sensors, and antennas directly into the three-dimensional molded plastic component. Achieving the desired functionality while optimizing the design for space, weight, and cost constraints requires a high level of technical expertise.

Designers must understand both the mechanical properties of the plastic materials and the electrical characteristics of the embedded components. They also need to consider factors like thermal management and manufacturing processes, which can further complicate the design. As MIDs continue to evolve and find applications in various industries, the demand for skilled MID designers and engineers has become a challenge.

Material Selection and Compatibility

Choosing the right materials for MIDs is a critical challenge. The plastic material used for molding must be compatible with the electronic components and the intended application. Material properties such as thermal conductivity, chemical resistance, and electrical insulation play a vital role in ensuring the reliability and performance of MIDs.

Different applications may require specific material characteristics, and selecting the wrong material can lead to issues such as overheating, signal interference, or premature component failure. Additionally, the global push for more sustainable and eco-friendly materials adds another layer of complexity to material selection.

Manufacturing Process Control

The manufacturing of MIDs involves several intricate steps, including injection molding, laser structuring, and metallization. Achieving consistent quality and precision in these processes is a significant challenge. Manufacturing tolerances are tight in MIDs, as any deviation in dimensions or positioning can affect the functionality and reliability of the final product.

Quality control throughout the manufacturing process is crucial, and this becomes even more challenging with the miniaturization and complexity of MIDs. Achieving repeatability and quality assurance while keeping production costs in check is an ongoing challenge for manufacturers.

Market Awareness and Adoption

Despite their potential advantages, MIDs still face a challenge in terms of market awareness and adoption. Many businesses and designers may not be fully aware of the capabilities and benefits of MIDs, leading to a lack of demand in some industries.

Moreover, the adoption of MIDs requires a shift in the design and manufacturing mindset. Designers and engineers need to consider MIDs as a viable alternative to traditional electronic packaging methods. Convincing industries to adopt this new approach can be challenging, especially when there is a perception of higher initial design and tooling costs.

Key Market Trends

Integration with IoT and Wearables

One of the foremost trends in the global Molded Interconnect Device market is the increasing integration of MIDs with Internet of Things (IoT) devices and wearables. As IoT and wearable technologies continue to gain prominence, MIDs are playing a crucial role in enhancing the functionality and design of these devices. MIDs enable the miniaturization of complex circuits, antennas, and sensors, allowing for the creation of compact and lightweight wearables with advanced capabilities.

IoT applications benefit from MIDs as they enable sensor integration directly into the device's structure, reducing the need for additional components. For example, MIDs can embed antennas into smart home devices, enhancing their wireless connectivity and reducing space requirements. As the IoT ecosystem expands, MIDs are expected to play a pivotal role in creating innovative and highly integrated connected devices.

Automotive Industry Adoption

The automotive industry is a major driver of the global MID market. As modern vehicles become more sophisticated with advanced driver assistance systems (ADAS), infotainment, and connectivity features, the demand for compact and reliable electronic components like MIDs is on the rise. MIDs offer a viable solution for automakers to address the space constraints in vehicles while ensuring robust electronic functionalities.

In automotive applications, MIDs are used for controls, sensors, lighting systems, and radar technology. They contribute to reducing the weight and size of automotive electronic systems while improving their performance. As electric vehicles (EVs) gain momentum and autonomous driving technologies advance, the need for MIDs in automotive applications is expected to grow substantially.

5G Connectivity and Antenna Integration

The deployment of 5G networks is a key driver for the integration of MIDs into various electronic devices. MIDs enable the design and integration of compact and efficient antennas, making them ideal for 5G-enabled devices such as smartphones, IoT sensors, and other wireless communication devices.

As 5G technology brings higher data speeds and lower latency, the demand for antennas with improved performance increases. MIDs allow for the direct embedding of antennas into device housings, optimizing their placement for superior connectivity. This trend is particularly notable in the smartphone industry, where manufacturers are increasingly adopting MIDs to enhance 5G antenna capabilities while maintaining sleek device designs.

Environmental Sustainability

Sustainability and environmental concerns are driving the adoption of MIDs in the global market. MIDs contribute to reducing electronic waste by optimizing the use of materials and space. As organizations and consumers become more conscious of the environmental impact of electronics manufacturing, MIDs offer a more eco-friendly alternative.

MIDs are often produced with recyclable materials, and their compact design helps minimize the overall environmental footprint of electronic devices. The automotive industry, in particular, benefits from MIDs' eco-friendly features by reducing the weight of vehicles, resulting in improved fuel efficiency and reduced emissions.

Segmental Insights

Process Insights

Laser Direct Structuring segment dominates in the global molded interconnect device market in 2023. Laser Direct Structuring involves the use of a laser to selectively activate specific areas of a three-dimensional molded plastic part. This activation process modifies the surface, allowing it to accept and bond with metal plating during subsequent processes. The activated areas effectively become conductive traces, enabling the integration of electrical circuits directly onto the plastic component.

LDS offers exceptional precision in activating specific areas of the plastic surface. Designers have significant flexibility in creating intricate and complex circuit patterns, which is crucial in applications where space constraints and high component density are common. Whether in the miniaturized electronics of smartphones or intricate automotive components, the LDS process excels at accommodating precise circuitry.

The LDS process is cost-effective, particularly when compared to alternative methods like two-shot molding. It simplifies manufacturing by eliminating the need for additional substrates, connectors, or adhesive layers, reducing material costs, and streamlining the assembly process. This cost efficiency is a critical driver for industries looking to reduce manufacturing expenses without compromising quality.

The LDS process simplifies material selection since it can be applied to a wide variety of plastics commonly used in manufacturing. This eliminates the need for specialized materials and ensures compatibility with a broad range of applications. It aligns well with the growing emphasis on sustainability, as recyclable plastics can be used without compromising performance.


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Regional Insights

Asia Pacific dominated the Global Molded Interconnect Device Market in 2023. Asia-Pacific is renowned for its robust manufacturing capabilities, particularly in the electronics sector. The region boasts a well-established infrastructure for electronics production, including state-of-the-art facilities and skilled labor. This expertise has enabled Asia-Pacific to excel in the fabrication of MIDs, which involve intricate processes such as injection molding, laser structuring, and metallization. Asia-Pacific offers cost-efficient manufacturing options, making it an attractive hub for MID production. The region's ability to produce high-quality MIDs at competitive prices has drawn the attention of businesses looking to optimize production costs. This cost-effectiveness is vital in a competitive global market. The Asia-Pacific region is home to a burgeoning consumer electronics market. The demand for compact, lightweight, and technologically advanced electronic devices is soaring, and MIDs align perfectly with this trend. MIDs enable the design of sleek and feature-rich products, making them a key component of smartphones, wearables, and other consumer electronics. Asia-Pacific is a hub for the automotive industry, with several countries experiencing robust growth in vehicle production. As MIDs are increasingly integrated into automotive electronics for applications such as advanced driver assistance systems (ADAS) and infotainment, the region's prominence in the auto sector drives the demand for MIDs. Many Asia-Pacific countries are investing heavily in research and development (R&D), fostering innovation and the advancement of MID technology. Governments and private enterprises in the region recognize the potential of MIDs and are supporting initiatives to develop new applications and materials, enhancing the region's leadership in this field.

Recent Developments

  • In May 2022, Taoglas has announced a strategic partnership with Dejerao, aimed at enhancing the capabilities of Dejerao's cellular bonding devices used in mobile applications. Under this collaboration, Taoglas will utilize its expertise in RF antennas to offer customized antenna solutions tailored specifically for Dejerao's customer base. By integrating Taoglas' high-performance RF antennas into Dejerao's cellular bonding devices, customers can anticipate improved signal strength, enhanced connectivity, and optimized performance across various mobile applications. This partnership highlights Taoglas' dedication to delivering advanced solutions to address the evolving needs of the mobile industry, while also enabling Dejerao to provide its customers with best-in-class antenna technology to elevate their mobile connectivity experience. Through this collaboration, both companies aim to foster innovation and deliver value-added solutions that empower users to remain connected and productive in today's increasingly mobile-centric environment.

Key Market Players

  • Molex, LLC
  • TE Connectivity Ltd.
  • Amphenol Corporation
  • LPKF Laser & Electronics SE
  • Taoglas Limited
  • HARTING, Inc.
  • M.I.D Solutions Pty Ltd
  • 2E Mechatronic GmbH & Co. KG
  • Kyocera AVX
  • JOHNAN Group

By Process

By Application

By Region
  • Laser Direct Structuring
  • Two-Shot Molding
  • Automotive
  • Consumer Products
  • Healthcare
  • Industrial
  • Military & Aerospace
  • Telecommunication
  • Others
  • North America
  • Europe
  • South America
  • Middle East & Africa
  • Asia Pacific


Report Scope:

In this report, the Global Molded Interconnect Device Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

                ·         Molded Interconnect Device Market, By Process:

o   Laser Direct Structuring

o   Two-Shot Molding

                ·         Molded Interconnect Device Market, By Application:

o   Automotive

o   Consumer Products

o   Healthcare

o   Industrial

o   Military & Aerospace

o   Telecommunication

o   Others

                ·         Molded Interconnect Device Market, By Region:

o   North America

§  United States

§  Canada

§  Mexico

o   Europe

§  Germany

§  France

§  United Kingdom

§  Italy

§  Spain

o   South America

§  Brazil

§  Argentina

§  Colombia

o   Asia-Pacific

§  China

§  India

§  Japan

§  South Korea

§  Australia

o   Middle East & Africa

§  Saudi Arabia

§  UAE

§  South Africa

Competitive Landscape

Company Profiles: Detailed analysis of the major companies present in the Global Molded Interconnect Device Market.

Available Customizations:

Global Molded Interconnect Device Market report with the given market data, TechSci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

Company Information

  • Detailed analysis and profiling of additional market players (up to five).

Global Molded Interconnect Device Market is an upcoming report to be released soon. If you wish an early delivery of this report or want to confirm the date of release, please contact us at [email protected]

Table of content

1.    Product Overview

1.1.    Market Definition

1.2.    Scope of the Market

1.2.1.    Markets Covered

1.2.2.    Years Considered for Study

1.2.3.    Key Market Segmentations

2.    Research Methodology

2.1.    Baseline Methodology

2.2.    Key Industry Partners

2.3.    Major Association and Secondary Sources

2.4.    Forecasting Methodology

2.5.    Data Triangulation & Validation

2.6.    Assumptions and Limitations

3.    Executive Summary

4.    Impact of COVID-19 on Global Molded Interconnect Device Market

5.    Voice of Customer

6.    Global Molded Interconnect Device Market Overview

7.    Global Molded Interconnect Device Market Outlook

7.1.    Market Size & Forecast

7.1.1.    By Value

7.2.    Market Share & Forecast

7.2.1.  By Process (Laser Direct Structuring, Two-Shot Molding)

7.2.2.  By Application (Automotive, Consumer Products, Healthcare, Industrial, Military & Aerospace, Telecommunication, Others)

7.2.3.  By Region (North America, Europe, South America, Middle East & Africa, Asia Pacific)

7.3.    By Company (2023)

7.4.    Market Map

8.    North America Molded Interconnect Device Market Outlook

8.1.    Market Size & Forecast

8.1.1.    By Value

8.2.    Market Share & Forecast

8.2.1.    By Process

8.2.2.    By Application

8.2.3.    By Country

8.2.3.1.        United States Molded Interconnect Device Market Outlook

8.2.3.1.1.        Market Size & Forecast

8.2.3.1.1.1.    By Value

8.2.3.1.2.        Market Share & Forecast

8.2.3.1.2.1.               By Process

8.2.3.1.2.2.               By Application

8.2.3.2.        Canada Molded Interconnect Device Market Outlook

8.2.3.2.1.        Market Size & Forecast

8.2.3.2.1.1.    By Value

8.2.3.2.2.        Market Share & Forecast

8.2.3.2.2.1.               By Process

8.2.3.2.2.2.               By Application

8.2.3.3.        Mexico Molded Interconnect Device Market Outlook

8.2.3.3.1.        Market Size & Forecast

8.2.3.3.1.1.    By Value

8.2.3.3.2.        Market Share & Forecast

8.2.3.3.2.1.               By Process

8.2.3.3.2.2.               By Application

9.    Europe Molded Interconnect Device Market Outlook

9.1.    Market Size & Forecast

9.1.1.  By Value

9.2.    Market Share & Forecast

9.2.1.    By Process

9.2.2.    By Application

9.2.3.    By Country

9.2.3.1.        Germany Molded Interconnect Device Market Outlook

9.2.3.1.1.        Market Size & Forecast

9.2.3.1.1.1.    By Value

9.2.3.1.2.        Market Share & Forecast

9.2.3.1.2.1.               By Process

9.2.3.1.2.2.               By Application

9.2.3.2.        France Molded Interconnect Device Market Outlook

9.2.3.2.1.        Market Size & Forecast

9.2.3.2.1.1.    By Value

9.2.3.2.2.        Market Share & Forecast

9.2.3.2.2.1.               By Process

9.2.3.2.2.2.               By Application

9.2.3.3.        United Kingdom Molded Interconnect Device Market Outlook

9.2.3.3.1.        Market Size & Forecast

9.2.3.3.1.1.    By Value

9.2.3.3.2.        Market Share & Forecast

9.2.3.3.2.1.               By Process

9.2.3.3.2.2.               By Application

9.2.3.4.        Italy Molded Interconnect Device Market Outlook

9.2.3.4.1.        Market Size & Forecast

9.2.3.4.1.1.    By Value

9.2.3.4.2.        Market Share & Forecast

9.2.3.4.2.1.               By Process

9.2.3.4.2.2.               By Application

9.2.3.5.        Spain Molded Interconnect Device Market Outlook

9.2.3.5.1.        Market Size & Forecast

9.2.3.5.1.1.    By Value

9.2.3.5.2.        Market Share & Forecast

9.2.3.5.2.1.               By Process

9.2.3.5.2.2.               By Application

10. South America Molded Interconnect Device Market Outlook

10.1. Market Size & Forecast

10.1.1.    By Value

10.2. Market Share & Forecast

10.2.1. By Process

10.2.2. By Application

10.2.3. By Country

10.2.3.1.     Brazil Molded Interconnect Device Market Outlook

10.2.3.1.1.   Market Size & Forecast

10.2.3.1.1.1.             By Value

10.2.3.1.2.   Market Share & Forecast

10.2.3.1.2.1.            By Process

10.2.3.1.2.2.            By Application

10.2.3.2.     Colombia Molded Interconnect Device Market Outlook

10.2.3.2.1.   Market Size & Forecast

10.2.3.2.1.1.             By Value

10.2.3.2.2.   Market Share & Forecast

10.2.3.2.2.1.            By Process

10.2.3.2.2.2.            By Application

10.2.3.3.     Argentina Molded Interconnect Device Market Outlook

10.2.3.3.1.   Market Size & Forecast

10.2.3.3.1.1.             By Value

10.2.3.3.2.   Market Share & Forecast

10.2.3.3.2.1.            By Process

10.2.3.3.2.2.            By Application

11. Middle East & Africa Molded Interconnect Device Market Outlook

11.1. Market Size & Forecast

11.1.1.    By Value

11.2. Market Share & Forecast

11.2.1. By Process

11.2.2. By Application

11.2.3. By Country

11.2.3.1.     Saudi Arabia Molded Interconnect Device Market Outlook

11.2.3.1.1.   Market Size & Forecast

11.2.3.1.1.1.             By Value

11.2.3.1.2.   Market Share & Forecast

11.2.3.1.2.1.            By Process

11.2.3.1.2.2.            By Application

11.2.3.2.     UAE Molded Interconnect Device Market Outlook

11.2.3.2.1.   Market Size & Forecast

11.2.3.2.1.1.             By Value

11.2.3.2.2.   Market Share & Forecast

11.2.3.2.2.1.            By Process

11.2.3.2.2.2.            By Application

11.2.3.3.     South Africa Molded Interconnect Device Market Outlook

11.2.3.3.1.   Market Size & Forecast

11.2.3.3.1.1.             By Value

11.2.3.3.2.   Market Share & Forecast

11.2.3.3.2.1.            By Process

11.2.3.3.2.2.            By Application

12. Asia Pacific Molded Interconnect Device Market Outlook

12.1. Market Size & Forecast

12.1.1.    By Value

12.2. Market Share & Forecast

12.2.1. By Process

12.2.2. By Application

12.2.3. By Country

12.2.3.1.     China Molded Interconnect Device Market Outlook

12.2.3.1.1.   Market Size & Forecast

12.2.3.1.1.1.             By Value

12.2.3.1.2.   Market Share & Forecast

12.2.3.1.2.1.            By Process

12.2.3.1.2.2.            By Application

12.2.3.2.     India Molded Interconnect Device Market Outlook

12.2.3.2.1.   Market Size & Forecast

12.2.3.2.1.1.             By Value

12.2.3.2.2.   Market Share & Forecast

12.2.3.2.2.1.            By Process

12.2.3.2.2.2.            By Application

12.2.3.3.     Japan Molded Interconnect Device Market Outlook

12.2.3.3.1.   Market Size & Forecast

12.2.3.3.1.1.             By Value

12.2.3.3.2.   Market Share & Forecast

12.2.3.3.2.1.            By Process

12.2.3.3.2.2.            By Application

12.2.3.4.     South Korea Molded Interconnect Device Market Outlook

12.2.3.4.1.   Market Size & Forecast

12.2.3.4.1.1.  By Value

12.2.3.4.2.   Market Share & Forecast

12.2.3.4.2.1.            By Process

12.2.3.4.2.2.            By Application

12.2.3.5.     Australia Molded Interconnect Device Market Outlook

12.2.3.5.1.   Market Size & Forecast

12.2.3.5.1.1.             By Value

12.2.3.5.2.   Market Share & Forecast

12.2.3.5.2.1.            By Process

12.2.3.5.2.2.            By Application

13. Market Dynamics

13.1.   Drivers

13.2.   Challenges

14. Market Trends and Developments

15. Company Profiles

15.1.   Molex, LLC

15.1.1.        Business Overview

15.1.2.        Key Revenue and Financials  

15.1.3.        Recent Developments

15.1.4.        Key Personnel

15.1.5.        Key Product/Services Offered

15.2.   TE Connectivity Ltd.

15.2.1.        Business Overview

15.2.2.        Key Revenue and Financials  

15.2.3.        Recent Developments

15.2.4.        Key Personnel

15.2.5.        Key Product/Services Offered

15.3.   Amphenol Corporation

15.3.1.        Business Overview

15.3.2.        Key Revenue and Financials  

15.3.3.        Recent Developments

15.3.4.        Key Personnel

15.3.5.        Key Product/Services Offered

15.4.   LPKF Laser & Electronics SE

15.4.1.        Business Overview

15.4.2.        Key Revenue and Financials  

15.4.3.        Recent Developments

15.4.4.        Key Personnel

15.4.5.        Key Product/Services Offered

15.5.   Taoglas Limited

15.5.1.        Business Overview

15.5.2.        Key Revenue and Financials  

15.5.3.        Recent Developments

15.5.4.        Key Personnel

15.5.5.        Key Product/Services Offered

15.6.   Harting, Inc.

15.6.1.        Business Overview

15.6.2.        Key Revenue and Financials  

15.6.3.        Recent Developments

15.6.4.        Key Personnel

15.6.5.        Key Product/Services Offered

15.7.   M.I.D Solutions Pty Ltd

15.7.1.        Business Overview

15.7.2.        Key Revenue and Financials  

15.7.3.        Recent Developments

15.7.4.        Key Personnel

15.7.5.        Key Product/Services Offered

15.8.   2E Mechatronic GmbH & Co. KG

15.8.1.        Business Overview

15.8.2.        Key Revenue and Financials  

15.8.3.        Recent Developments

15.8.4.        Key Personnel

15.8.5.        Key Product/Services Offered

15.9.   KYOCERA AVX

15.9.1.        Business Overview

15.9.2.        Key Revenue and Financials  

15.9.3.        Recent Developments

15.9.4.        Key Personnel

15.9.5.        Key Product/Services Offered

15.10.JOHNAN Group

15.10.1.     Business Overview

15.10.2.     Key Revenue and Financials  

15.10.3.     Recent Developments

15.10.4.     Key Personnel

15.10.5.     Key Product/Services Offered

16. Strategic Recommendations

17.     About Us & Disclaimer

Figures and Tables

Frequently asked questions

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The market size of the global molded interconnect device market was USD 3.53 Billion in 2023.

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Laser Direct Structuring was the dominant segment in the global molded interconnect device market in 2023 by process due to its versatility, precision, and efficiency in manufacturing complex three-dimensional circuitry. LDS technology enables the direct structuring of circuit patterns onto injection-molded plastic components by using laser ablation to activate a special additive material within the plastic substrate.

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The challenges in the global molded interconnect device market include design complexity and expertise, material selection and compatibility, manufacturing process control, market awareness and adoption, etc.

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The major drivers for the global molded interconnect device market include miniaturization and space efficiency, improved electrical performance, cost savings and simplified assembly, enhanced product aesthetics, etc.

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Sakshi Bajaal

Business Consultant
Press Release

Molded Interconnect Device Market Expands with Laser Direct Structuring Segment at a robust CAGR of 12.73% through 2029

Sep, 2024

The increasing global molded interconnect device market is driven by miniaturization and space efficiency, improved electrical performance during the forecast period 2025-2029.

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