Dicing & Backgrinding Tapes Market - Global Industry Size, Share, Trends, Opportunity, and Forecast, Segmented By Type (Dicing Tapes, Backgrinding Tapes), By Material (Polyolefin, Polyvinyl Chloride (PVC), Polyethylene Terephthalate (PET), Others), By Application (Memory, Logic, MEMS, CMOS Image Sensors, Power Devices, Others), By Region, and By Competition, 2021-2031F

Forecast Period	2027-2031
Market Size (2025)	USD 2.27 Billion
CAGR (2026-2031)	7.12%
Fastest Growing Segment	Memory
Largest Market	Asia Pacific
Market Size (2031)	USD 3.43 Billion

Market Overview

The Global Dicing & Backgrinding Tapes Market will grow from USD 2.27 Billion in 2025 to USD 3.43 Billion by 2031 at a 7.12% CAGR. The Global Dicing and Backgrinding Tapes Market consists of specialized adhesive consumables essential for semiconductor back-end assembly. Backgrinding tapes protect active circuitry during wafer thinning, while dicing tapes anchor wafers to frames for precise singulation. These materials are fundamental to ensuring high yield rates as manufacturers adopt ultra-thin wafer technologies for compact electronic devices.

Market expansion is driven by the demand for miniaturized electronics and 3D chip stacking which requires thinner wafer profiles. This aligns with broader sector growth. According to SEMI, in 2024, the global semiconductor packaging materials market was forecast to exceed $26 billion by 2025. However, the industry faces a significant challenge in balancing adhesion properties. Developing tapes that hold firmly during processing yet release without residue or damaging fragile wafers remains a complex technical obstacle.

Key Market Drivers

The expansion of automotive electronics and electric vehicles acts as a primary catalyst for the market, fundamentally altering the technical requirements for processing consumables. Modern automotive power modules, particularly those utilizing silicon carbide, necessitate rigorous backgrinding to reduce electrical resistance and improve heat dissipation, while dicing tapes must withstand thicker, harder substrates during singulation to prevent chipping. This surge in power semiconductor fabrication directly increases the consumption volume of specialized high-adhesion tapes. According to the International Energy Agency, April 2024, in the 'Global EV Outlook 2024', electric car sales were projected to reach approximately 17 million units in 2024, signaling a sustained upward trajectory for chip integration in the mobility sector which drives the recurring demand for these essential process materials.

Simultaneously, the adoption of advanced semiconductor packaging technologies for artificial intelligence and high-performance computing forces manufacturers to utilize ultra-thin wafers, thereby elevating the criticality of high-quality backgrinding tapes. Stacking techniques like High Bandwidth Memory require extreme wafer thinning, where tapes serve as the sole structural support to prevent breakage during grinding and transport. Major industry players are heavily capitalizing on these packaging capabilities to support AI infrastructure. According to SK Hynix, April 2024, in the 'SK Hynix Signs Investment Agreement of Advanced Chip Packaging with Indiana' press release, the company committed an estimated $3.87 billion to build a fabrication facility focused on next-generation chips. This infrastructure growth correlates with broader substrate trends, as dicing and grinding consumables are volume-dependent. According to SEMI, in 2024, worldwide silicon wafer shipments increased 5.9% quarter-over-quarter in the third quarter, indicating a recovering baseline for material demand.

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Key Market Challenges

The difficulty in balancing adhesion properties presents a persistent technical barrier that restricts the scalability of the Global Dicing and Backgrinding Tapes Market. Manufacturers require tapes that maintain a robust hold during rigorous grinding and dicing processes to prevent wafer shifting, yet these same materials must release cleanly without leaving residue or damaging the ultra-thin silicon. This trade-off creates a high risk of yield loss, causing semiconductor companies to hesitate in adopting newer, thinner tape formulations essential for advanced packaging. This reluctance slows the replacement cycle of legacy products and limits revenue opportunities for high-performance adhesive solutions.

The financial impact of this technical limitation is magnified by the sheer volume of silicon processed, where even minor adhesive defects translate into considerable material waste. The industry operates at a scale where throughput efficiency is critical, and any inconsistency in tape performance acts as a production bottleneck. According to SEMI, in November 2024, worldwide silicon wafer shipments totaled 3,214 million square inches for the third quarter. Such high production volumes demand near-perfect reliability from adhesive consumables. Consequently, the inability to consistently guarantee this balance forces the industry to prioritize process stability over adhesive innovation, dampening the growth trajectory for the market.

Key Market Trends

The accelerated adoption of UV-curable dicing tapes represents a critical shift in the market as manufacturers seek to maximize yield for increasingly fragile and miniaturized dies. Unlike standard pressure-sensitive adhesives, these advanced tapes utilize a switchable adhesion mechanism that maintains a secure hold during the rigorous singulation process but drastically reduces bond strength upon exposure to ultraviolet light. This functionality is becoming essential for processing complex logic chips and power devices where mechanical stress during pickup must be minimized to prevent cracking. Reflecting this industry-wide transition toward higher-specification consumables, According to Furukawa Electric, June 2024, in the 'Furukawa Electric Opens New Factory for IC Process Tapes' press release, the company invested 7 billion yen to establish a new production facility at its Mie Works, aiming to increase its manufacturing capacity for high-quality semiconductor tapes by 1.5 times by 2030.

Simultaneously, the Development of Ultra-Thin Wafer Handling Solutions is reshaping the technology landscape, driven by the necessity to process wafers thinned below 50 microns for 3D stacking. This trend is characterized by the replacement of traditional mechanical peeling methods with next-generation temporary bonding and debonding systems that utilize light or heat for stress-free release. These innovations are fundamental to maintaining the structural integrity of the silicon substrate during backgrinding and subsequent transport steps. According to Resonac, September 2024, in the 'Resonac Develops Temporary Bonding Film and New Debonding Process for Advanced Semiconductor Packages' press release, the company unveiled a new temporary bonding film designed for xenon flash light irradiation, enabling the residue-free and low-stress separation of carrier films from fragile next-generation wafers.

Segmental Insights

The Memory segment represents the fastest-growing category in the Global Dicing and Backgrinding Tapes Market. This robust expansion is driven by the increasing integration of advanced die-stacking technologies in consumer electronics and enterprise storage systems. As manufacturers produce thinner wafers to accommodate higher density memory architectures, the need for reliable tape solutions to prevent breakage during processing has surged. Consequently, the industry is witnessing elevated demand for high-performance tapes that ensure structural integrity during the critical thinning and singulation phases of semiconductor manufacturing.

Regional Insights

Asia Pacific holds the leading position in the global dicing and backgrinding tapes market, primarily driven by the high concentration of semiconductor manufacturing hubs in the region. Nations such as China, Taiwan, Japan, and South Korea house significant semiconductor fabrication plants and assembly service providers, creating a sustained demand for wafer processing materials. The region benefits from a well-established electronics manufacturing ecosystem and the local presence of key material suppliers, particularly in Japan, which streamlines the supply chain and supports the high-volume production requirements of the industry.

Recent Developments

• In September 2024, Resonac Corporation announced the development of an advanced temporary bonding film and a new debonding technology for semiconductor packaging processes. This innovation utilizes a proprietary film designed to securely hold wafers during thinning and back-end processing, coupled with a debonding method that employs xenon flash light irradiation. The new process enables the film to be removed easily without applying mechanical stress or heat, thereby preventing damage to ultra-thin wafers. This breakthrough addressed the critical need for cleaner, higher-yield manufacturing solutions for next-generation semiconductor devices, such as those used in artificial intelligence applications.
• In June 2024, Furukawa Electric Co., Ltd. inaugurated its new manufacturing facility, the Mie Factory No. 2, located in Kameyama City, Mie Prefecture, Japan. The company invested approximately 7 billion yen to construct this plant, which is dedicated to producing high-performance tapes for semiconductor processing, including dicing and backgrinding tapes. This expansion aimed to increase production capacity significantly to meet the surging global demand for advanced semiconductors driven by the spread of generative AI and digitalization. The facility was designed to ensure a stable supply of high-quality materials required for increasingly complex chip manufacturing processes and to support the company's business continuity plans.
• In April 2024, Mitsui Chemicals, Inc. completed the reorganization of its ICT business by establishing a new wholly owned subsidiary, Mitsui Chemicals ICT Materia, Inc. This strategic move involved splitting off the protective films and industrial films businesses, including the "ICROS™" tape used in semiconductor manufacturing, from Mitsui Chemicals Tohcello, Inc. The creation of this new entity was intended to accelerate decision-making and enhance the development of solution-based film products. By consolidating these operations, the company aimed to better address the rapid technological innovations and diverse needs within the semiconductor and electronic components markets.
• In April 2024, Lintec Corporation announced the introduction of a new Bump Support Film, a specialized adhesive tape designed to improve the reliability of Wafer Level Chip Scale Packages (WLCSP). The product features a unique structure that integrates a resin layer with a backgrinding tape, providing robust protection for solder bumps during the wafer thinning process. Unlike conventional tapes, the resin layer remains on the chip surface after the tape is removed, reinforcing the connection points and preventing cracks. This launch targeted the growing demand for smaller, lighter, and more durable semiconductor components in mobile devices.

Key Market Players

• 3M Company
• Nitto Denko Corporation
• Tesa SE.
• Lintec Corporation
• Dow Inc.
• Semiconductor Equipment Corporation.
• Kyocera Corporation
• Singamas Container Industry Company Limited
• Mitsui Chemicals, Inc
• Fujifilm Corporation.

By Type	By Material	By Application	By Region
Dicing Tapes Backgrinding Tapes	Polyolefin Polyvinyl Chloride (PVC) Polyethylene Terephthalate (PET) Others	Memory Logic MEMS CMOS Image Sensors Power Devices Others	North America Europe Asia Pacific South America Middle East & Africa

Report Scope:

In this report, the Global Dicing & Backgrinding Tapes Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

• Dicing & Backgrinding Tapes Market, By Type:

• Dicing Tapes
• Backgrinding Tapes

• Dicing & Backgrinding Tapes Market, By Material:

• Polyolefin
• Polyvinyl Chloride (PVC)
• Polyethylene Terephthalate (PET)
• Others

• Dicing & Backgrinding Tapes Market, By Application:

• Memory
• Logic
• MEMS
• CMOS Image Sensors
• Power Devices
• Others

• Dicing & Backgrinding Tapes Market, By Region:

• North America
• United States
• Canada
• Mexico
• Europe
• France
• United Kingdom
• Italy
• Germany
• Spain
• Asia Pacific
• China
• India
• Japan
• Australia
• South Korea
• South America
• Brazil
• Argentina
• Colombia
• Middle East & Africa
• South Africa
• Saudi Arabia
• UAE