Power Supply In Package Chip Market to Grow with a CAGR of 5.21% through 2029

Miniaturization & Integration Trends in Consumer Electronics,  Growth in Adoption of Advanced Semiconductor Technologies, and Rising Wide Bandgap (WBG) Materials for Enhanced Performance propel the market throughout the forecast period.

According to TechSci Research report, “Power Supply In Package Chip Market - Global Industry Size, Share, Trends, Competition Forecast & Opportunities, 2029. Global Power Supply In Package Chip Market was valued at USD 1.67 Billion in 2023 and is anticipated to project robust growth in the forecast period with a CAGR of 5.21% through 2029.

The global Power Supply in Package (PSiP) chip market is primarily driven by the increasing demand for compact and efficient power management solutions across various industries. PSiP chips integrate multiple power management functions, such as voltage regulation, switching converters, and thermal management, into a single package. This integration reduces PCB footprint, enhances system reliability, and improves overall energy efficiency, making them ideal for applications in consumer electronics, automotive, telecommunications, and industrial sectors. In the consumer electronics segment, there is a growing trend towards smaller, lightweight devices with longer battery life and faster charging capabilities. PSiP chips enable manufacturers to achieve these goals by providing efficient power delivery solutions that optimize energy consumption and reduce heat generation. The automotive industry is also a significant driver for the PSiP chip market, particularly with the rise of electric vehicles (EVs) and autonomous driving technologies. PSiP chips support advanced power management requirements in EVs, such as battery management systems (BMS), motor control units (MCUs), and onboard chargers, contributing to increased vehicle range and efficiency.

The deployment of 5G infrastructure globally is fueling demand for PSiP chips in telecommunications equipment. These chips ensure reliable and efficient power supply to 5G base stations, routers, and mobile devices, supporting the high-speed data processing and low-latency communication demands of 5G networks. The versatility, efficiency, and scalability of PSiP chips are driving their adoption across diverse applications, driving growth in the global market. 

Browse over XX market data Figures spread through XX Pages and an in-depth TOC on "Global Power Supply In Package Chip Market”

Based on application, Consumer Electronics held largest market share in 2023.  The global Power Supply in Package (PSiP) chip market is significantly driven by the burgeoning consumer electronics sector, where compact, efficient power management solutions are essential for powering a wide array of devices, ranging from smartphones and tablets to wearable gadgets and smart home appliances. One of the primary drivers in the consumer electronics segment is the relentless demand for smaller, lighter, and more energy-efficient devices. Consumers and manufacturers alike seek products that offer enhanced portability without compromising performance. PSiP chips provide integrated power solutions that combine multiple functions—such as voltage regulation, DC-DC conversion, and thermal management—into a single package. This integration not only reduces the size and weight of power management circuits but also improves energy efficiency, extending battery life and enhancing overall device performance. For instance, in smartphones and wearables, PSiP chips enable efficient power delivery to support high-speed processors, vibrant displays, and multiple sensors, while maintaining slim form factors and prolonged battery operation.

The rapid pace of technological advancements in consumer electronics drives continuous innovation in PSiP chip design and functionality. As devices become more sophisticated and feature-rich, the demand for advanced power management solutions grows. PSiP chips evolve to meet these demands by offering higher power density, improved thermal management capabilities, and enhanced reliability. Manufacturers are integrating innovative materials and semiconductor technologies—such as gallium nitride (GaN) and silicon carbide (SiC)—into PSiP designs to achieve higher efficiency and faster switching speeds, thereby supporting the next generation of high-performance consumer electronics.

The proliferation of IoT devices and smart home technologies is fueling demand for PSiP chips in consumer electronics. IoT devices require efficient power management solutions that can handle varying power loads and operate reliably in diverse environmental conditions. PSiP chips enable seamless integration of power management functions directly into IoT devices, ensuring optimal performance and connectivity while minimizing energy consumption. From smart thermostats and security cameras to connected appliances and voice-controlled assistants, PSiP technology plays a critical role in powering and enabling the functionality of these interconnected devices within the smart home ecosystem.

Major companies operating in Global Power Supply In Package Chip Market are:

• Infineon Technologies AG
• Texas Instruments Incorporated
• Semiconductor Components Industries, LLC
• STMicroelectronics International N.V.
• Analog Devices, Inc.
• NXP Semiconductors N.V.
• Renesas Electronics Corporation
• Vishay Intertechnology, Inc.
• Panasonic Corporation
• Lextar Electronics Corp. 

Download Free Sample Report

Customers can also request for 10% free customization on this report.

“The Global Power Supply In Package Chip Market is expected to rise in the upcoming years and register a significant CAGR during the forecast period. The global Power Supply in Package (PSiP) chip market presents a significant opportunity driven by the burgeoning demand for compact, efficient power solutions across diverse industries. PSiP chips integrate power supply components into a single package, offering advantages such as reduced size, improved thermal management, and enhanced reliability. This integration meets the needs of applications ranging from consumer electronics to automotive and industrial sectors, where space efficiency and reliability are paramount. With ongoing advancements in semiconductor packaging technology and increasing adoption of portable and IoT devices, the PSiP chip market is poised for substantial growth, offering lucrative opportunities for innovation and market expansion. Therefore, the Market of Power Supply In Package Chip is expected to boost in the upcoming years”, said Mr. Karan Chechi, Research Director of TechSci Research, a research-based management consulting firm.

“Power Supply In Package Chip Market – Global Industry Size, Share, Trends, Opportunity, and Forecast, Segmented By Product (PSiP and PwrSoC), By Application (Telecom and IT, Automotive, Consumer Electronics, Medical Devices, and Military & Defense), By Region, By Competition, 2019-2029F”, has evaluated the future growth potential of Global Power Supply In Package Chip Market and provides statistics & information on market size, structure and future market growth. The report intends to provide cutting-edge market intelligence and help decision makers take sound investment decisions. Besides, the report also identifies and analyzes the emerging trends along with essential drivers, challenges, and opportunities in Global Power Supply In Package Chip Market.

Contact

Techsci Research LLC

420 Lexington Avenue, Suite 300,

New York, United States- 10170

Tel: +13322586602

Email: [email protected]               

Website: www.techsciresearch.com