Wafer Bonder is Expected to Dominate the Global Semiconductor Bonding Market
The
impact of digitalization on lives and businesses has led to a boom in the
semiconductor markets. This has resulted in government programs supporting the deployment
of 5G.
According to TechSci
Research report, “Global Semiconductor Bonding Market - Industry Size,
Share, Trends, Competition Forecast & Opportunities, 2028”. The Global Semiconductor Bonding is anticipated to
project robust growth in the forecast period with a CAGR of 3.6% through 2028. The growing demand for
semiconductor products, such as chips, from the automotive & industrial
sectors, is expected to bolster the growth of the semiconductor bonding market.
The automotive market registered a growth in 2022. Further, wireless
communications, dominated by smartphones, had a growth of 24.6%. According to
the Semiconductor Today data, the number of 5G handsets produced grew from 251
million units in 2020 to 556 million in 2022. Further, the rising demand for
wearables, smartphones, and 5G services is anticipated to fuel the
semiconductor bonding market growth over the forecast period.According to the
EU report, Europe aims to produce the next generation of leading-edge chips (2nm)
by 2030. European semiconductor companies such as Infineon Technologies and
ASML Holding are investing heavily in research and development to develop
advanced semiconductor bonding solutions. Further, the growing number of
European startups in semiconductor bonding is expected to provide new
opportunities for digital technologies in the semiconductor industry. Moreover,
the growing adoption of electric vehicles across European countries, with
support from the government’s green initiatives, is expected to contribute to
the semiconductor bonding market growth. For instance, the UK government has
set an aim for all electric vehicles by 2030 to support environmental
sustainability standards.
Browse over xx market
data Figures spread through 188 Pages and an in-depth TOC on " Global Semiconductor Bonding Market"
By bonding technology, the
semiconductor bonding market growth is segregated into die bonding technology
and wafer bonding technology. The die-bonding technology segment dominated the
market, in terms of revenue, in 2021, and is expected to follow the same trend
during the forecast period. On the basis of application, the semiconductor
bonding industry is divided into RF devices, MEMS and sensors, CMOS image
sensors, LED, and 3D NAND. The LED segment acquired the largest share in 2021,
and the 3D NAND segment is expected to grow at a high CAGR from 2022 to 2031. The
semiconductor bonding market is being driven by the growing adoption of stacked
die technology in IoT devices and the rising demand for electric and hybrid
vehicles in various regions. Furthermore, increasing demand for 3D
semiconductor assembly and packaging as well as the growing adoption of IoT and
AI in the automotive sector will provide new opportunities for the
semiconductor bonding industry. The Europe semiconductor bonding market was
significantly hampered during the COVID-19 pandemic in the second quarter of
2020. The sales of semiconductors and motor vehicles fell during the second
quarter of 2020; this shortfall in sales was more than offset by an increased
need for computer and electronic equipment due to the shift to remote working
and learning norms. Europe is home to various leading automakers such as
Mercedes, Volkswagen, Skoda, BMW, and Audi. The automotive sector in Europe was
severely affected due to delays in reopened assembly plants by original
equipment manufacturers (OEMs), a shortage of semiconductors, and reduced
vehicle sales. Thus, the shortage of semiconductor chips and shipping
disruptions hampered the operations of automotive part suppliers and the
delivery of semiconductor technology equipment. With the growth of data
centers, cloud computing, and high-performance computing applications, there is
a need for advanced semiconductor bonding to create chips with higher
processing power, lower latency, and greater energy efficiency. The rollout of
5G technology has necessitated the development of semiconductor bonding
solutions for RF (radio frequency) and mmWave (millimeter-wave) applications.
Bonding techniques are used to create chips that can handle the high-frequency
demands of 5G.
Key market players in the
Global Semiconductor Bonding Market are following:-
- Garmin
Ltd.
- Canon
Inc
- Aerialtronics
DV B.V.
- GoPro,
Inc.
- Sony
Corporation
- DST
CONTROL
- DJI
- Controp
Precision Technologies Ltd
- FLIR
Systems, Inc.
- Panasonic
Corporation
Download Free Sample Report
Customers can also request for 10% free customization on
this report.
“.The development and
production of semiconductor bonding components in Europe mainly occur in
Germany, France, Italy, the Netherlands, Belgium, Austria, and Ireland.
European companies supply semiconductor products, including chips and wafer
ICs, to the automotive, industrial automation, security, healthcare,
aeronautics, energy production, and telecommunication sectors. For instance,
the growing initiatives for the development of the 5G network across European
countries are also expected to bolster the Europe semiconductor bonding market
growth. The demand for smaller, more powerful, and energy-efficient electronic
devices has been a major driver of the semiconductor bonding market. As
consumers and industries seek compact and versatile gadgets, semiconductor
bonding plays a crucial role in integrating various functions into a single
chip. The growth of advanced packaging technologies, such as 3D packaging,
system-in-package (SiP), and wafer-level packaging (WLP), has significantly
increased the need for advanced semiconductor bonding solutions. These
packaging technologies enable the creation of smaller, faster, and more
energy-efficient electronic devices”said Mr. Karan Chechi, Research Director
with TechSci Research, a research-based global management consulting firm.
Semiconductor Bonding Market – Global Industry
Size, Share, Trends, Opportunity, and Forecast Segmented, By Type (Die Bonder,
Wafer Bonder, Flip Chip Bonder), By Process Type (Die To Die Bonding, Die To
Wafer Bonding, Wafer To Wafer Bonding), By Bonding Technology (Die Bonding
Technology, Wafer Bonding Technology), By Application (RF Devices, Mems and
Sensors, CMOS Image Sensors, LED, 3D NAND) By Region, By Competition 2018-2028. has evaluated the future growth
potential of Global Semiconductor
Bonding Market and provides statistics and information on market structure,
size, share, and future growth. The report is intended to provide cutting-edge
market intelligence and help decision makers take sound investment decisions.
Besides, the report also identifies and analyzes the emerging trends along with
essential drivers, challenges, and opportunities present in the Global Semiconductor
Bonding Market.
Contact
Techsci Research LLC
420 Lexington Avenue, Suite 300,
New York, United States- 10170
Tel: +13322586602
Email: [email protected]
Website: www.techsciresearch.com